Key properties of C10200 Oxygen Free Copper wire:
High Conductivity: The absence of oxygen impurities enhances the electrical conductivity of C10200 copper, making it suitable for applications where efficient electrical performance is essential.
Excellent Thermal Conductivity: In addition to its electrical conductivity, C10200 copper also exhibits excellent thermal conductivity. This property makes it suitable for applications in which heat dissipation is a consideration.
Ductility and Formability: C10200 copper is highly ductile and can be easily formed into various shapes. This makes it suitable for wire production, where flexibility and formability are important.
Corrosion Resistance: While not as corrosion-resistant as some other metals like aluminum or stainless steel, C10200 copper has good resistance to corrosion in many environments.
Applications:
End Product | Specification |
Wire, Coated With Lead Alloy | ASTM B189 |
Wire, Coated With Nickel | ASTM B355 |
Wire, Coated With Silver | ASTM B298 |
Wire, Coated With Tin | ASTM B33, B246 |
Wire, Flat | ASTM B272 |
Wire, Hard Drawn | ASTM B1, FEDERAL QQ-W-343 |
Wire, Medium-Hard Drawn | ASTM B2, FEDERAL QQ-W-343 |
Wire, Metallizing | MILITARY MIL-W-6712 |
Wire, Soft | AMS 4701, ASTM B3, B738, B48, F9, FEDERAL QQ-W-343 |
Wire, Stranded | ASTM B8, B174, B470, B172, B173, B286, B496, B226, FEDERAL QQ-B-575 |
CU | O | |
Min/Max | 99.95 min | 0.001 |
Nominals | - | - |
TEMPER | SECT. SIZE | COLD WORK | TYPE MIN | TEMP | TENSILE STRENGTH | YS 0.05% UL |
YS 0.02% OFFSET |
YS 0.005% OFFSET |
ELONG. | RH B |
RH C |
RH F |
RH 30T |
VH 500 |
BH 500 |
BH 3000 |
SHEAR STRGTH |
FATIGUE STRGTH |
IZOD IMPACT STRGTH |
- | in. | % | - | F | ksi | ksi | ksi | ksi | % | B | C | F | 30T | 500 | 500 | 3000 | ksi | ksi | ft-lb |
- | mm. | - | - | C | MPa | MPa | MPa | MPa | - | - | - | - | - | - | - | - | MPa | MPa | J |
Wire | |||||||||||||||||||
H04 | 0.08 | 68 | 55 | - | - | - | - | - | - | - | - | - | - | - | 29 | - | |||
H04 | 2 | 0 | TYP | 20 | 379 | - | - | - | 1 | - | - | - | - | - | - | - | 200 | - | 0 |
OS050 | 0.08 | 68 | 35 | - | - | - | - | - | - | - | - | - | - | - | 24 | - | |||
OS050 | 2 | 0 | TYP | 20 | 241 | - | - | - | 35 | - | - | - | - | - | - | - | 165 | - | 0 |
H08 | 0.08 | 68 | 66 | - | - | - | - | - | - | - | - | - | - | - | 33 | - | |||
H08 | 2 | 0 | TYP | 20 | 455 | - | - | - | 1 | - | - | - | - | - | - | - | 228 | - | 0 |
PRODUCT PROPERTY | US CUSTOMARY | METRIC |
Coefficient of Thermal Expansion | 9.4 . 10 6? per å¡F (68-212 F) | 16.9 . 10 6? per å¡C (20-100 C) |
Coefficient of Thermal Expansion | 9.6 . 10 6? per å¡F (68-392 F) | 17.3 . 10 6? per å¡C (20-200 C) |
Coefficient of Thermal Expansion | 9.8 . 10 6? per å¡F (68-572 F) | 17.6 . 10 6? per å¡C (20-300 C) |
Density | 0.323 lb/in3 @ 68 F | 8.94 gm/cm3 @ 20 C |
Electrical Conductivity | 101%IACS @ 68 F | 0.591 MegaSiemens/cm @ 20 C |
Electrical Resistivity | 10.3 ohms-cmil/ft @ 68 F | 1.71 microhm-cm @ 20 C |
Melting Point Liquid US | 1981 F | 1083 C |
Melting Point Solid US | 1981 F | 1083 C |
Modulas of Elasticity in Tension | 17000 ksi | 117000 MPa |
Modulas of Rigidity | 6400 ksi | 44130 MPa |
Specific Gravity | 8.94 | 8.94 |
Specific Heat Capacity | 0.092 Btu/lb/å¡F at 68 F | 393.5 J/kg . å¡K at 293 K |
Thermal Conductivity | 226.0 Btu . ft/(hr . Ft2 . å¡F) at 68 F | 391.1W/m . å¡K at 20 C |